3M™ Wafer De-Taping Tape 3305, 25 mm x 100 m

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(00051141414683)
Package Qty: 6
Quantity:
 
3M™ Wafer De-Taping Tape 3305 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M™ WSS adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.

Feature:
Comes in box of 6 units.
Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding. Transparency allows for inspection without tape removal. High instant adhesion to substrate. Good holding power.

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